alloy |
A uniform mixture of two or more materials. One of the materials must be a metal. |
chlorofluorocarbon |
A chemical compound with both chlorine and fluorine, formerly used as refrigerants, propellants, and cleaning solvents. Chlorofluorocarbons were banned because of their negative effects on the ozone layer. |
cold joint |
A dull, poorly soldered joint that does not provide good conductivity. |
conductivity |
A measure of a material's ability to conduct current. |
contact angle |
The angle at which a liquid meets a solid surface. In soldering, contact angle is measured as the distance between the soldering iron and the surface being soldered. Decreased contact angles encourage proper wetting with solders. |
corrosive |
A chemical solid, liquid, or gas capable of irreparably harming living tissues or damaging material on contact. Corrosive chemicals include acids and certain organic materials. |
eutectic point |
The lowest temperature at which a substance will melt. |
flux |
A substance which facilitates soldering, brazing, and welding by chemically cleaning the metals to be joined. |
flux pen |
A flux application tool, usually shaped like a marker pen, that channels controlled amounts of water-soluble flux onto metal surfaces. |
fume extractor |
A device designed to remove harmful fumes caused by solder and flux from the soldering workstation by filtering the air. |
good joint |
A properly soldered joint that provides good conductivity. |
halide |
A highly reactive, highly corrosive compound that attacks dirt and bacteria. Chlorine and flouride are common halides. |
heat transfer |
The passage of thermal energy, i.e. energy in the form of heat, from a hot to a cold body. |
icicles |
Jagged extensions or spikes protruding from a soldered joint. Icicles can be caused by an iron that is too cool. |
lead |
A soft, heavy, toxic, and malleable metal often used in solder. Because of the serious health hazards associated with lead exposure, there is a growing movement to eliminate lead from all consumer products. |
lead-based solder |
Solder that contains more than 0.2% lead. Lead-based solder has been the standard soldering alloy for the past several decades. |
lead-free solder |
Solder that contains less than 0.2% lead. Lead-free solder has different properties and appearance than lead-based solder. Lead-free solder is dull and grainy, and requires hotter soldering temperatures. |
lead-free soldering |
Soldering with metal alloys that contain only trace amounts of lead, or no lead at all. |
ORH1 |
A specific flux classification. Composition is organic (OR) with high activity (H) and the presence of a halide (1). |
oxidation |
A material's chemical reaction with oxygen. Oxidation causes rust and tarnish to form on metal surfaces and also prevents solder from properly bonding to surfaces. |
Pb-free solder |
Solder that contains less than 0.2% lead. Pb is the atomic symbol for lead. |
pre-tinned |
Tinned by the manufacturer before the tip has ever been used. |
SAC |
Tin (Sn), silver (Ag), and copper (Cu). This is one of the most commonly used lead-free alloys. |
SnCu |
Tin (Sn) and copper (Cu). This is one of the most commonly used lead-free alloys. |
surface tension |
An effect within the surface layer of a liquid that causes that layer to behave as an elastic sheet. This effect allows insects (such as the water strider) to walk on water, and causes capillary action. |
thermal profile |
The range of temperatures involved in a heating process. |
toxic |
Poisonous or harmful. Many substances can be harmless with small amounts of exposure and toxic with large amounts of exposure. |
water table |
The water table is found underground. Rock and soil are saturated with water that can feed or seep into wells or other water sources used by people for drinking. |
wettability |
The ability of a liquid to spread out over a surface. |
wetting |
The behavior of a liquid when the liquid contacts a solid surface. Liquids with poor wetting ability tend to form droplets, while liquids with good wetting ability tend to spread out evenly over the solid surface area. |
whiskers |
A crystalline metallurgical phenomenon whereby metal grows tiny, filiform hairs. The effect is primarily seen on elemental metals but also occurs with alloys. |
wicking |
Capillary action that draws a liquid up and away from a surface. |